What is Smart Cut?
Smart Cut is Soitec’s patented process technology for creating “engineered” wafers. Engineered wafers (such as Silicon-On-Insulator, or SOI) consist of multiple layers of substrate materials.
Beginning in mainstream volume with the 130nm geometries of 2001 followed by the 90nm node being launched in 2003/2004, leading-edge IC manufacturers have used engineered wafers with specific electro-mechanical properties. With each subsequent generation, the wafer material properties are slated to become even more stringent. Smart Cut is a process technology that enables wafer suppliers to create the full range of engineered wafers for both current and future generations of electronics.